【HNETR-10】Deposition Research

案件番号

HNETR-10


About Company

  • world leader in gases, technologies and services for industry and health since 1902.
  • Currently present in 80 countries with more than 66,000 employees. Six R&D sites are located all over the globe.
  • One of them located in AL’s Innovation Campus Tokyo in Yokosuka, Japan.He/she will evaluate novel ALD/CVD precursors and develop new cutting-edge processes for the semiconductor industry.
  • The researcher will work in a multicultural environment and closely with internal and external customers and partners.。

Job Description

Evaluation of novel organometallic or silicon-based precursors in ALD/CVD thin film processing and analysis of the films.


Job Description

  • Position: deposition research
  • Working Area: Kanagawa
  • Salary: 5 million - 6 millon base + bonus

Application Requirements

Requirements

  • Master degree or equivalent
  • English business level required.E-mail exchanges and meetings are held in English.
  • Safe handling of pyrophoric, toxic, and combustible materials.
  • ALD/CVD of thin films with organometallic and silicon-based compounds
  • Thin-film analysis using XPS, SEM, AFM, ellipsometry, FT-IR, etc.
  • Support ALD/CVD deposition tool maintenance
  • Timely and concise reporting (R&D reports, patent applications, internal meetings, customer meetings, etc.)
  • Group and customer support
  • Join the safety activity in ALL
  • Effective team player, communication skills, working in an international environment

Preferred skills

  • PhD or Postdoc
  • Japanese conversation level is a plus
  • Experience in a relevant private or academic R&D lab is a plus

Compesations and Benefits

・ Working hours: 9:00 - 12:00, 13:00 - 17:30 from Monday to Friday (flextime)
・ Holidays: Saturdays & Sundays, ALL Anniversary (Feb 26), Japanese national holidays, summer holiday (Aug 15), Christmas holiday (Dec 25), New Year holidays (Dec 29 - Jan 3 + TBA)
・ Japan
・ Commuting allowance
・ Relocation and housing compensation: TBD


Interview Process

Application Review → First round of interview → Final round of interview


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